广发彩票软件:製程能力

製程能力

層數
PCB stack-up
1-20 Layer
最大板厚
Max. board thickness
125.98mil (3.20mm)
最小板厚(多層板)
Min. board thickness (ML)
12 mil (0.3mm)
最小板厚(雙面板)
Min. board thickness (DL)
8mil (0.2mm)
最小內層板厚
Min. Inner layer thickness
2mil
最大工作板尺寸
Max. WPNL Size
550mmX 450mm
內層銅厚
Inner layer copper thickness
0.3 oz~5.0 oz
外層銅厚
Outer layer copper thickness
0.3 oz~4.0oz
最小鉆孔孔徑
Minimum drill hole size
6mil (0.15mm)
最大縱橫比
Max. width rate
1:8
板厚誤差控制
Thickness error control
± 10%
外層線路之線寬 / 距
Circuit width / spacing in outer layer
3/3 mil
內層線路之線寬 / 距
Circuit width / spacing in inner layer
3/3 mil
最小SMT焊墊間距
Pitch limited SMT spacing
8mil (0.2 mm)
最小 BGA焊墊間距
Pitch limited BGA spacing
6 mil (0.15 mm)
最小防焊印刷寬度
Limited solder mask print width
3 mil (0.075 mm)
防焊對位誤差控制
Solder positioning and accuracy control
± 2 mil
阻抗控制
Impedance control
Ω ± 10%
層間對位誤差控制
Layer registration tolerance control
± 6mil (0.15mm)
板彎翹(曲)
Board warpage control
± 0.7%
成型邊內縮距離
Pattern to Board edge
(T<= 1.6mm)
CNC 6mil
V-Cut 15mil